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FHE devices combine printed conductors with bare die integration techniques on silicon to yield functional devices.
December 6, 2017
By: Anthony Locicero
With the long talked about NextFlex Labs and Technology Hub coming online in the second half of 2017, the first question is, what will we find there? At the basic level, FHE devices combine printed conductors with bare die integration techniques on silicon to yield functional devices. Therefore, it reasons that both printing and bare die integration process tools will be centrally featured at the NextFlex Technology Hub. Mike Mastropietro, senior engineering manager of Printing and Additive...
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